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一、综合性语汇
1、印制电路：printed circuit
2、印刷路线：printed wiring
3、印制电路板：printed board
4、印制电路板电源电路：printed circuit board(PCB)
5、印刷pcb线路板：printed wiring board(PWB)
6、印刷部件：printed component
7、印刷触点：printed contact
8、印制电路板安装：printed board assembly
9、板：board
10、单层印制电路板：single-sided printed board(SSB)
11、两面印制电路板：double-sided printed board(DSB)
12、双层印制电路板：mulitlayer printed board(MLB)
13、双层pcb电路板：mulitlayer printed circuit board
14、双层印刷pcb线路板：mulitlayer prited wiring board
15、刚度印制电路板：rigid printed board
16、刚度单层印制电路板：rigid single-sided printed borad
17、刚度两面印制电路板：rigid double-sided printed borad
18、刚度双层印制电路板：rigid multilayer printed board
19、挠性双层印制电路板：flexible multilayer printed board
20、挠性印制电路板：flexible printed board
21、挠性单层印制电路板：flexible single-sided printed board
22、挠性两面印制电路板：flexible double-sided printed board
23、挠性印制电路：flexible printed circuit(FPC)
24、挠性印刷路线：flexible printed wiring
25、刚度印制电路板：flex-rigid printed board,rigid-flex printed board
26、刚度两面印制电路板：flex-rigid double-sided printed board,rigid-flex double-sided printed
27、刚度双层印制电路板：flex-rigid multilayer printed board,rigid-flex multilayer printed board
28、平齐印制电路板：flush printed board
29、金属材料芯印制电路板：metal core printed board
30、金属材料基印制电路板：metal base printed board
31、多种走线印制电路板：mulit-wiring printed board
32、瓷器印制电路板：ceramic substrate printed board
33、导电胶带印制电路板：electroconductive paste printed board
34、橡塑制品线路板：molded circuit board
35、模压印制电路板：stamped printed wiring board
36、次序压层双层印制电路板：sequentially-laminated mulitlayer
37、散线印制电路板：discrete wiring board
38、微线印制电路板：micro wire board
39、陶瓷基片印制电路板：buile-up printed board
40、陶瓷基片双层印制电路板：build-up mulitlayer printed board(BUM)
41、陶瓷基片挠印制电路板：build-up flexible printed board
42、表层合线路板：surface laminar circuit(SLC)
43、埋进凸块连印制电路板：B2it printed board
44、双层膜基材：multi-layered film substrate(MFS)
45、固层全内导通双层印制电路板：ALIVH multilayer printed board
46、载集成ic板：chip on board(COB)
47、埋电阻器板：buried resistance board
48、母板：mother board
49、线路板：daughter board
50、侧板：backplane
51、裸板：bare board
52、电脑键盘板夹芯板：copper-invar-copper board
53、动态性挠性板：dynamic flex board
54、静态数据挠性板：static flex board
55、可断拼板方式：break-away planel
56、电缆线：cable
57、挠性扁平电缆：flexible flat cable(FFC)
58、薄膜开关：membrane switch
59、混和电源电路：hybrid circuit
60、厚膜：thick film
61、厚膜电源电路：thick film circuit
62、塑料薄膜：thin film
63、塑料薄膜混和电源电路：thin film hybrid circuit
64、互联：interconnection
65、输电线：conductor trace line
66、平齐输电线：flush conductor
67、同轴电缆：transmission line
68、跨交：crossover
69、板外电源插头：edge-board contact
70、提高板：stiffener
71、底材：substrate
72、基材面：real estate
73、输电线面：conductor side
74、部件面：component side
75、电焊焊接面：solder side
76、印刷：printing
77、网格图：grid
78、图型：pattern
79、导电性图型：conductive pattern
80、非导电性图型：non-conductive pattern
81、标识符：legend
82、标示：mark
二、板材：
1、板材：base material
2、玻纤板：laminate
3、覆金属材料箔板材：metal-clad bade material
4、覆铜泊玻纤板：copper-clad laminate(CCL)
5、单层覆铜泊玻纤板：single-sided copper-clad laminate
6、两面覆铜泊玻纤板：double-sided copper-clad laminate
7、复合型玻纤板：composite laminate
8、薄玻纤板：thin laminate
9、金属材料芯覆铜泊玻纤板：metal core copper-clad laminate
10、金属材料基覆铜玻纤板：metal base copper-clad laminate
11、挠性覆铜泊绝缘层塑料薄膜：flexible copper-clad dielectric film
12、基材原材料：basis material
13、预浸料原材料：prepreg
14、粘接片：bonding sheet
15、预浸料粘接片：preimpregnated bonding sheer
16、环氧树脂玻璃基板：epoxy glass substrate
17、加成法用玻纤板：laminate for additive process
18、预制构件里层覆箔板：mass lamination panel
19、里层细木工板：core material
20、催化反应家具板材：catalyzed board,coated catalyzed laminate
21、点胶催化反应玻纤板：adhesive-coated catalyzed laminate
22、点胶无催玻纤板：adhesive-coated uncatalyzed laminate
23、粘接层：bonding layer
24、粘接膜：film adhesive
25、涂胶黏剂绝缘层塑料薄膜：adhesive coated dielectric film
26、无支撑点胶黏剂膜：unsupported adhesive film
27、覆盖：cover layer(cover lay)
28、提高家具板材：stiffener material
29、铜泊面：copper-clad surface
30、去铜泊面：foil removal surface
31、玻纤板面：unclad laminate surface
32、基膜面：base film surface
33、胶黏剂面：adhesive faec
34、初始光亮面：plate finish
35、粗面：matt finish
36、竖向：length wise direction
37、模向：cross wise direction
38、粘贴板：cut to size panel
39、酚醛树脂纸版覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧树脂纸版覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)
41、环氧树脂玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、环氧树脂玻璃布纸复合型覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates
43、环氧树脂玻璃布玻纤复合型覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚脂玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚丙烯腈玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧树脂玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧树脂人造纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四丁二烯玻纤覆铜箔板：teflon/fiber glass copper-clad laminates
49、薄型玻纤板：ultra thin laminate
50、瓷器基覆铜箔板：ceramics base copper-clad laminates
51、紫外光阻拦型覆铜箔板：UV blocking copper-clad laminates
三、板材的原材料
1、A阶环氧树脂：A-stage resin
2、B阶环氧树脂：B-stage resin
3、C阶环氧树脂：C-stage resin
4、环氧树脂胶：epoxy resin
5、脲醛树脂：phenolic resin
6、聚氨酯树脂：polyester resin
7、聚酰亚胺树脂：polyimide resin
8、双马来酰亚胺三嗪环氧树脂：bismaleimide-triazine resin
9、丙烯酸乳液：acrylic resin
10、三聚氰胺甲醛树脂：melamine formaldehyde resin
11、多官能环氧树脂胶：polyfunctional epoxy resin
12、溴化环氧树脂胶：brominated epoxy resin
13、环氧树脂酚醛树脂：epoxy novolac
14、氟环氧树脂：fluroresin
15、有机硅树脂：silicone resin
16、氯硅烷：silane
17、高聚物：polymer
18、不定形高聚物：amorphous polymer
19、结晶体状况：crystalline polamer
20、双晶状况：dimorphism
21、聚合物：copolymer
22、防腐蚀涂料：synthetic
23、热固性树脂：thermosetting resin
24、热塑性树脂：thermoplastic resin
25、感旋光性环氧树脂：photosensitive resin
26、环氧树脂剂量：weight per epoxy equivalent(WPE)
27、环氧树脂值：epoxy value
28、双氰胺：dicyandiamide
29、粘接剂：binder
30、胶黏剂：adesive
31、环氧固化剂：curing agent
32、无卤阻燃剂：flame retardant
33、遮光剂：opaquer
34、增粘剂：plasticizers
35、不饱和聚酯：unsatuiated polyester
36、pvc膜：polyester
37、聚酰亚胺薄膜：polyimide film(PI)
38、聚四氟乙烯：polytetrafluoetylene(PTFE)
39、聚全氟丁二烯pe塑料薄膜：perfluorinated ethylene-propylene copolymer film(FEP)
40、提高原材料：reinforcing material
41、玻纤：glass fiber
42、E玻纤：E-glass fibre
43、D玻纤：D-glass fibre
44、S玻纤：S-glass fibre
45、玻璃布：glass fabric
46、非织布：non-woven fabric
47、玻纤垫：glass mats
48、棉纱：yarn
49、拉丝：filament
50、绞股：strand
51、细纱：weft yarn
52、管纱：warp yarn
53、但尼尔机械纪元：denier
54、纬向：warp-wise
55、纬向：weft-wise,filling-wise
56、纺织物经伟相对密度：thread count
57、纺织结构：weave structure
58、平纹布机构：plain structure
59、坏布：grey fabric
60、稀松纺织物：woven scrim
61、弓纬：bow of weave
62、断经：end missing
63、缺纬：mis-picks
64、纬斜：bias
65、皱褶：crease
66、云织：waviness
67、鱼眼镜头：fish eye
68、毛圈长：feather length
69、薄厚段：mark
70、缝隙：split
71、纤度：twist of yarn
72、浸润剂成分：size content
73、浸润剂残余量：size residue
74、改性剂成分：finish level
75、浸润剂：size
76、硅烷偶联剂：couplint agent
77、解决纺织物：finished fabric
78、醋酯纤维：polyarmide fiber
79、聚酯纤维面料非织布：non-woven polyester fabric
80、预浸绝缘层纵纸：impregnating insulation paper
81、聚芳酰胺化学纤维纸：aromatic polyamide paper
82、破裂长：breaking length
83、吸湿相对高度：height of capillary rise
84、湿抗压强度保存率：wet strength retention
85、光泽度：whitenness
86、瓷器：ceramics
87、导电性箔：conductive foil
88、铜泊：copper foil
89、电解铜箔：electrodeposited copper foil(ED copper foil)
90、压延铜箔：rolled copper foil
91、淬火铜泊：annealed copper foil
92、注塑淬火铜泊：rolled annealed copper foil(RA copper foil)
93、薄铜泊：thin copper foil
94、点胶铜泊：adhesive coated foil
95、点胶脂铜泊：resin coated copper foil(RCC)
96、复合型金属材料箔：composite metallic material
97、媒介箔：carrier foil
98、殷瓦：invar
99、箔（截面）轮廊：foil profile
100、亮面：shiny side
101、不光滑面：matte side
102、解决面：treated side
103、防锈处理：stain proofing
104、两面解决铜泊：double treated foil
四、设计方案
1、电路原理图：shematic diagram
2、逻辑图：logic diagram
3、印刷路线布置：printed wire layout
4、布置总平面图：master drawing
5、可生产制造性设计方案：design-for-manufacturability
6、辅助设计设计方案：computer-aided design.(CAD)
7、辅助设计生产制造：computer-aided manufacturing.(CAM)
8、电子计算机集成化生产制造：computer integrat manufacturing.(CIM)
9、辅助设计工程项目：computer-aided engineering.(CAE)
10、辅助设计检测：computer-aided test.(CAT)
11、电子产品设计自动化技术：electric design automation.(EDA)
12、建筑工程设计自动化技术：engineering design automaton.(EDA2)
13、拼装设计方案自动化技术：assembly aided architectural design.(AAAD)
14、辅助设计绘图：computer aided drawing
15、计算机系统控制表明：computer controlled display.(CCD)
16、合理布局：placement
17、走线：routing
18、布图设计方案：layout
19、重布：rerouting
20、仿真模拟：simulation
21、逻辑模拟：logic simulation
22、电路模拟：circit simulation
23、时序模拟：timing simulation
24、模块化设计：modularization
25、走线达成率：layout effeciency
26、设备叙述文件格式：machine deionm format.(MDF)
27、设备叙述文件格式数据库查询：MDF databse
28、设计方案数据库查询：design database
29、设计方案起点：design origin
30、提升（设计方案）：optimization(design)
31、供设计方案提升纵坐标：predominant axis
32、报表起点：table origin
33、镜像文件：mirroring
34、推动文档：drive file
35、正中间文档：intermediate file
36、生产制造文档：manufacturing documentation
37、序列支撑点数据库查询：queue support database
38、部件按置：component positioning
39、图型表明：graphics dispaly
40、占比因素：scaling factor
41、扫描仪添充：scan filling
42、矩形框添充：rectangle filling
43、添充域：region filling
44、实体线设计方案：physical design
45、数字逻辑：logic design
46、时序逻辑电路：logic circuit
47、层级设计方案：hierarchical design
48、自顶向下设计方案：top-down design
49、自底向上设计方案：bottom-up design
50、道路网：net
51、智能化：digitzing
52、设计方案标准查验：design rule checking
53、走（布）线器：router(CAD)
54、互联网表：net list
55、辅助设计电路分析：computer-aided circuit analysis
56、子道路网：subnet
57、目标函数：objective function
58、设计方案后处理工艺：post design processing(PDP)
59、互动式绘图设计方案：interactive drawing design
60、花费引流矩阵：cost metrix
61、装配图：engineering drawing
62、格子框架图：block diagram
63、谜宫：moze
64、部件相对密度：component density
65、巡回演出营业员问题：traveling salesman problem
66、可玩性：degrees freedom
67、入度：out going degree
68、出度：incoming degree
69、曼哈顿距离：manhatton distance
70、欧几里德间距：euclidean distance
71、互联网：network
72、列阵：array
73、段：segment
74、逻辑性：logic
75、数字逻辑自动化技术：logic design automation
76、分线：separated time
77、分层次：separated layer
78、定次序：definite sequenc
五、样子与规格：
1、输电线（无线信道）：conduction(track)
2、输电线（体）总宽：conductor width
3、输电线间距：conductor spacing
4、输电线层：conductor layer
5、输电线总宽/间隔：conductor line/space
6、第一输电线层：conductor layer No.1
7、环形盘：round pad
8、方型盘：square pad
9、棱形盘：diamond pad
10、长方型焊层：oblong pad
11、炮弹形盘：bullet pad
12、滴泪盘：teardrop pad
13、雪娃娃盘：snowman pad
14、V形盘：V-shaped pad
15、圆形盘：annular pad
16、非环形盘：non-circular pad
17、防护盘：isolation pad
18、非作用联接盘：monfunctional pad
19、偏置联接盘：offset land
20、腹（背）裸盘：back-bard land
21、盘址：anchoring spaur
22、联接盘图型：land pattern
23、联接盘网格图列阵：land grid array
24、孔环：annular ring
25、部件孔：component hole
26、安裝孔：mounting hole
27、支撑点孔：supported hole
28、非支撑点孔：unsupported hole
29、导埋孔：via
30、镀埋孔：plated through hole(PTH)
31、余隙孔：access hole
32、埋孔：blind via(hole)
33、埋孔：buried via hole
34、埋/埋孔：buried/blind via
35、随意层內部导埋孔：any layer inner via hole(ALIVH)
36、所有打孔：all drilled hole
37、精准定位孔：toaling hole
38、无联接盘孔：landless hole
39、正中间孔：interstitial hole
40、无联接盘导埋孔：landless via hole
41、正确引导孔：pilot hole
42、线接全隙孔：terminal clearomee hole
43、准表层间镀覆孔：quasi-interfacing plated-through hole
44、准规格孔：dimensioned hole
45、在联接盘里导埋孔：via-in-pad
46、孔距：hole location
47、孔相对密度：hole density
48、孔图：hole pattern
49、打孔图：drill drawing
50、cad零件图：assembly drawing
51、印制电路板拼装图：printed board assembly drawing
52、参照标准：datum referan
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